CAPACITY
| process | capacity/day |
| plasma | 1400 m² |
| Through-hole plating including desmear | 850 m² |
| Blind Via Filling |
450 m² |
| conductive pattern construction | 200 m² |
| galvanic Ni/Au | 150 m² |
| chemical Ni/Au (ENIG) | 1200 m² |
| DIG |
200 m² |
| chemical Ni/Au TRG (ENIG TRG) | |
| chemical Palladium/Gold (EPIG) | 200 m² |
| chemical Ni/reductive gold | 30 m² |
| chemical Ni/Pd/Au (ENEPIG) | 500 m² |
| chemical tin | 1500 m² |
| OSP | 500 m² |
| chemical silver | 1500 m² |
| Microfill Advanced |
120 m² |
| Reel to Reel | on request |
